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PASSION FOR IDEAS |
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NEXX SystemsNEXX Systems brings exceptional technical expertise to flip chip and advancedpackaging. Our product lines provide the most efficient, yet affordable, systems of their kind: Nimbus for multilayer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals.
December 12, 2006 NEXX Systems to Participate in IMEC's Industrial Affiliation Program for 3D Wafer Level Packaging and Integrated Passives |
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| partner of the European Tech Tour |  |
"The partners have been very supportive of our approach and stepped in to add value when needed. I would strongly recommend them as investors." Didier Cowling, Founder and CEO, Kuros Biosurgery AG |
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technology
semiconductor & hardware
Sven Lingjaerde